4 layers FPC, with 1.5OZ base copper in inner layers.

For normal copper substrate thickness, 1/3OZ, 1/2OZ, 1OZ can be option.

If need thicker copper thickness, can choose suitable copper substrate, and plating copper on copper substrate, to achieve ideal finished copper thickness.

Normally, the plating copper thickness will range from 25um to 35um.

If customer no special requirement, we’ll control the copper thickness on hole copper with 20um+/-5um, and wall copper with 35um+/-5um.